WS1M8-17CI
vs
DPS1MS8MP-70I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
MICROSEMI CORP
TWILIGHT TECHNOLOGY INC
Part Package Code
DIP
MODULE
Package Description
DIP,
DIP, DIP32,.6
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
17 ns
70 ns
Additional Feature
TTL COMPATIBLE INPUTS/OUTPUTS
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS
JESD-30 Code
R-CDIP-T32
R-CDMA-T32
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
1MX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.13 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.6
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.000135 A
Standby Voltage-Min
2 V
Supply Current-Max
0.1 mA
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare WS1M8-17CI with alternatives
Compare DPS1MS8MP-70I with alternatives