WED8L24258V15BI
vs
EDI8L24257V12BC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE MICROELECTRONICS
|
| Package Description |
14 X 22 MM, MO-163, BGA-119
|
MO-163, BGA-119
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
15 ns
|
12 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
| Length |
22 mm
|
|
| Memory Density |
6291456 bit
|
6291456 bit
|
| Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
| Memory Width |
24
|
24
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
119
|
119
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256KX24
|
256KX24
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA119,7X17,50
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.794 mm
|
|
| Standby Current-Max |
0.09 A
|
|
| Standby Voltage-Min |
3.14 V
|
|
| Supply Current-Max |
0.48 mA
|
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare WED8L24258V15BI with alternatives
Compare EDI8L24257V12BC with alternatives