WED8L24257V12BC vs GS76024AGB-12T feature comparison

WED8L24257V12BC White Electronic Designs Corp

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GS76024AGB-12T GSI Technology

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP GSI TECHNOLOGY
Package Description 14 X 22 MM, MO-163, BGA-119 BGA,
Reach Compliance Code unknown compliant
Access Time-Max 12 ns 12 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
Length 22 mm 22 mm
Memory Density 6291456 bit 6291456 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 24 24
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX24 256KX24
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.794 mm 1.99 mm
Standby Current-Max 0.09 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.48 mA
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 119
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

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