WED8L24257V12BC
vs
GS76024B-10T
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
WHITE MICROELECTRONICS
|
GSI TECHNOLOGY
|
Package Description |
BGA-119
|
BGA,
|
Reach Compliance Code |
unknown
|
compliant
|
Access Time-Max |
12 ns
|
10 ns
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B119
|
Memory Density |
6291456 bit
|
6291456 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
24
|
24
|
Number of Functions |
1
|
1
|
Number of Terminals |
119
|
119
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256KX24
|
256KX24
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
119
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
JESD-609 Code |
|
e0
|
Length |
|
22 mm
|
Package Code |
|
BGA
|
Seated Height-Max |
|
2.4 mm
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
14 mm
|
|
|
|
Compare GS76024B-10T with alternatives