WE512K8200CM vs 5962-9309104HXX feature comparison

WE512K8200CM Microsemi Corporation

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5962-9309104HXX White Microelectronics

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP WHITE MICROELECTRONICS
Part Package Code DIP
Package Description HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 200 ns 200 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
JESD-609 Code e4
Length 42.8 mm 42.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type EEPROM MODULE EEPROM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX8 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.13 mm 6.98 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.25 mm 15.24 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 2 1
Additional Feature AUTOMATIC WRITE
Package Equivalence Code DIP32,.6
Screening Level MIL-PRF-38534 Class H
Standby Current-Max 0.01 A
Supply Current-Max 0.18 mA

Compare WE512K8200CM with alternatives

Compare 5962-9309104HXX with alternatives