WE512K8200CM
vs
WE512K8-200CI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
WHITE MICROELECTRONICS
Part Package Code
DIP
Package Description
HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
DIP-32
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A991.B.1.B.1
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
200 ns
200 ns
JESD-30 Code
R-CDIP-T32
R-CDIP-T32
JESD-609 Code
e4
Length
42.8 mm
42.8 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
EEPROM MODULE
EEPROM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
512KX8
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.13 mm
5.13 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.25 mm
15.24 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
3
2
Additional Feature
AUTOMATIC WRITE
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