5962-9309104HXX
vs
WE512K8200CQA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MERCURY SYSTEMS INC
MICROSEMI CORP
Package Description
DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
200 ns
200 ns
Additional Feature
AUTOMATIC WRITE
JESD-30 Code
R-CDIP-T32
R-CDIP-T32
Length
42.4 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
EEPROM MODULE
EEPROM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX8
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Seated Height-Max
6.98 mm
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.5 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Base Number Matches
3
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-9309104HXX with alternatives
Compare WE512K8200CQA with alternatives