W25X64VZPI vs S25FL064LABMFN010 feature comparison

W25X64VZPI Winbond Electronics Corp

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S25FL064LABMFN010 Cypress Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code SON
Package Description HVSON, SOIC-8
Pin Count 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 33 MHz 108 MHz
JESD-30 Code R-PDSO-N8 S-PDSO-G8
Length 6 mm 5.28 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SOP
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 0.8 mm 2.16 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 5 mm 5.28 mm
Base Number Matches 1 2
Rohs Code Yes
Date Of Intro 2016-09-26
Additional Feature IT ALSO HAVE X1 MEMORY WIDTH
Alternate Memory Width 2
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare W25X64VZPI with alternatives

Compare S25FL064LABMFN010 with alternatives