W25X64VZPI
vs
M25PX64-VMP3TB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Part Package Code
SON
Package Description
HVSON,
Pin Count
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
33 MHz
JESD-30 Code
R-PDSO-N8
Length
6 mm
Memory Density
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
Number of Functions
1
Number of Terminals
8
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
HVSON
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
Programming Voltage
3 V
2.7 V
Qualification Status
Not Qualified
Seated Height-Max
0.8 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Type
NOR TYPE
Width
5 mm
Base Number Matches
1
1
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