W25X64VZPI vs M25PX64-VMP6TBA feature comparison

W25X64VZPI Winbond Electronics Corp

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M25PX64-VMP6TBA Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Part Package Code SON
Package Description HVSON,
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 33 MHz
JESD-30 Code R-PDSO-N8
Length 6 mm
Memory Density 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 8
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL
Type NOR TYPE
Width 5 mm
Base Number Matches 1 1

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