W25Q80BLUXIP
vs
S25FL008A0LNFI001
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WINBOND ELECTRONICS CORP
ADVANCED MICRO DEVICES INC
Package Description
HVSON,
SON, SOLCC8,.25
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
80 MHz
50 MHz
JESD-30 Code
R-PDSO-N8
R-PDSO-N8
Length
3 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
Number of Terminals
8
8
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
1MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
Seated Height-Max
0.6 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
2 mm
Base Number Matches
1
2
Rohs Code
Data Retention Time-Min
20
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
SOLCC8,.25
Qualification Status
Not Qualified
Serial Bus Type
SPI
Standby Current-Max
0.00001 A
Supply Current-Max
0.024 mA
Type
NOR TYPE
Write Protection
HARDWARE/SOFTWARE
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