W25Q80BLUXIP
vs
MPA17128PI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MOTOROLA INC
Package Description
HVSON,
DIP,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
Clock Frequency-Max (fCLK)
80 MHz
JESD-30 Code
R-PDSO-N8
R-PDIP-T8
Length
3 mm
9.78 mm
Memory Density
8388608 bit
131072 bit
Memory IC Type
FLASH
OTP ROM
Memory Width
8
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1048576 words
131072 words
Number of Words Code
1000000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
128KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
Seated Height-Max
0.6 mm
4.45 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
2 mm
7.62 mm
Base Number Matches
1
2
Part Package Code
DIP
Pin Count
8
Qualification Status
Not Qualified
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Compare MPA17128PI with alternatives