W25P020AF-6 vs MT58LC128K32D9BG-8.5 feature comparison

W25P020AF-6 Winbond Electronics Corp

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MT58LC128K32D9BG-8.5 Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Part Package Code QFP BGA
Package Description QFP, 14 X 22 MM, BGA-119
Pin Count 100 119
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 6 ns 4.5 ns
JESD-30 Code R-PQFP-G100 R-PBGA-B119
Length 20 mm 22 mm
Memory Density 2097152 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX32 128KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.32 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.15 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Rohs Code No
Additional Feature AUTOMATIC POWER DOWN
Clock Frequency-Max (fCLK) 117 MHz
I/O Type COMMON
JESD-609 Code e0
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code BGA119,7X17,50
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.275 mA
Terminal Finish Tin/Lead (Sn/Pb)

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Compare MT58LC128K32D9BG-8.5 with alternatives