W24L01B-70LI
vs
AS7C251026LL-100TI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
BGA
TSOP2
Package Description
TFBGA, BGA36(UNSPEC)
SOP, TSOP44,.46,32
Pin Count
48
44
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
100 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
R-PDSO-G44
Length
11 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
131072 words
65536 words
Number of Words Code
128000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
64KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
SOP
Package Equivalence Code
BGA36(UNSPEC)
TSOP44,.46,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.05 mm
Standby Voltage-Min
1.5 V
1.5 V
Supply Current-Max
0.04 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3 V
Supply Voltage-Min (Vsup)
2.7 V
2.3 V
Supply Voltage-Nom (Vsup)
3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
DUAL
Width
8 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
240
Standby Current-Max
0.000005 A
Terminal Finish
TIN LEAD
Compare W24L01B-70LI with alternatives
Compare AS7C251026LL-100TI with alternatives