W24257AQ-20
vs
SMDP-65656L45
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
TEMIC SEMICONDUCTORS
Part Package Code
TSOP
Package Description
8 X 13.40 MM, TSOP1-28
Pin Count
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
20 ns
45 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G28
R-CDFP-F28
JESD-609 Code
e0
Length
11.8 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSOP1
DFP
Package Equivalence Code
TSSOP28,.53,22
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
FLAT
Terminal Pitch
0.55 mm
Terminal Position
DUAL
DUAL
Width
8 mm
Base Number Matches
1
10
Number of Ports
1
Output Enable
YES
Screening Level
MIL-STD-883 Class B
Compare W24257AQ-20 with alternatives
Compare SMDP-65656L45 with alternatives