SMDP-65656L45
vs
5962-9318710HTA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
AEROFLEX MICROELECTRONIC SOLUTIONS
Reach Compliance Code
unknown
unknown
Access Time-Max
45 ns
17 ns
JESD-30 Code
R-CDFP-F28
S-XPGA-P66
Memory Density
262144 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
32
Number of Functions
1
Number of Ports
1
Number of Terminals
28
66
Number of Words
32768 words
131072 words
Number of Words Code
32000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
128KX32
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DFP
PGA
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
38535Q/M;38534H;883B
Standby Voltage-Min
2 V
2 V
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
PIN/PEG
Terminal Position
DUAL
PERPENDICULAR
Base Number Matches
1
6
Rohs Code
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
I/O Type
COMMON
JESD-609 Code
e0
Package Equivalence Code
PGA66,11X11
Standby Current-Max
0.0116 A
Supply Current-Max
0.6 mA
Terminal Finish
Tin/Lead (Sn/Pb) - hot dipped
Terminal Pitch
2.54 mm
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