VND830ASP
vs
VND5E050K-E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
SOIC
SOIC
Package Description
HSOP, SOP10,.55FL
ROHS COMPLIANT, SSOPP-24
Pin Count
10
24
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
STMicroelectronics
STMicroelectronics
Built-in Protections
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits
2
2
Interface IC Type
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code
R-PDSO-G10
R-PDSO-G24
JESD-609 Code
e3
Length
9.4 mm
10.3 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
10
24
Output Current Flow Direction
SOURCE
SOURCE
Output Peak Current Limit-Nom
9 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HSOP
HSSOP
Package Equivalence Code
SOP10,.55FL
SOP24,.4,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel)
250
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.65 mm
2.47 mm
Supply Voltage-Max
36 V
28 V
Supply Voltage-Min
5.5 V
4.5 V
Supply Voltage-Nom
13 V
13 V
Surface Mount
YES
YES
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
7.5 mm
7.5 mm
Base Number Matches
4
2
Output Current-Max
2 A
Compare VND830ASP with alternatives
Compare VND5E050K-E with alternatives