USD545E3
vs
USD520
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
DIGITRON SEMICONDUCTORS
|
| Package Description |
HERMETIC SEALED, METAL, DO-5, 1 PIN
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
35 Weeks
|
|
| Additional Feature |
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
|
| Application |
EFFICIENCY
|
|
| Case Connection |
CATHODE
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.68 V
|
|
| JEDEC-95 Code |
DO-203AB
|
|
| JESD-30 Code |
O-MUPM-D1
|
|
| Non-rep Pk Forward Current-Max |
1000 A
|
|
| Number of Elements |
1
|
|
| Number of Phases |
1
|
|
| Number of Terminals |
1
|
|
| Operating Temperature-Max |
175 °C
|
|
| Output Current-Max |
75 A
|
|
| Package Body Material |
METAL
|
|
| Package Shape |
ROUND
|
|
| Package Style |
POST/STUD MOUNT
|
|
| Reverse Current-Max |
20000 µA
|
|
| Surface Mount |
NO
|
|
| Technology |
SCHOTTKY
|
|
| Terminal Form |
SOLDER LUG
|
|
| Terminal Position |
UPPER
|
|
| Base Number Matches |
2
|
4
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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