USD545E3
vs
MBR6025L
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MOTOROLA INC
|
| Package Description |
HERMETIC SEALED, METAL, DO-5, 1 PIN
|
O-MUPM-D1
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
FREE WHEELING DIODE
|
| Application |
EFFICIENCY
|
POWER
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.68 V
|
0.48 V
|
| JEDEC-95 Code |
DO-203AB
|
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
1000 A
|
10000 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Output Current-Max |
75 A
|
60 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Reverse Current-Max |
20000 µA
|
50000 µA
|
| Surface Mount |
NO
|
NO
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
2
|
4
|
| Operating Temperature-Min |
|
-65 °C
|
| Qualification Status |
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
|
25 V
|
|
|
|
Compare USD545E3 with alternatives
Compare MBR6025L with alternatives