UPTB550
vs
MXLUPTB5E3
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| Collector Current-Max (IC) |
0.1 A
|
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
5
|
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
140 °C
|
150 °C
|
| Polarity/Channel Type |
NPN
|
|
| Power Dissipation-Max (Abs) |
1.5 W
|
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Transition Frequency-Nom (fT) |
15 MHz
|
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
40 Weeks
|
| Additional Feature |
|
HIGH RELIABILITY, MIL-STD-750
|
| Breakdown Voltage-Min |
|
6 V
|
| Clamping Voltage-Max |
|
9.5 V
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
|
DO-216AA
|
| JESD-30 Code |
|
S-PSSO-G1
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
1000 W
|
| Number of Terminals |
|
1
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE
|
| Polarity |
|
BIDIRECTIONAL
|
| Power Dissipation-Max |
|
2.5 W
|
| Reference Standard |
|
AEC-Q101; IEC-61000-4-2, 4-4, 4-5; MIL-PRF-19500
|
| Rep Pk Reverse Voltage-Max |
|
5 V
|
| Reverse Current-Max |
|
50 µA
|
| Reverse Test Voltage |
|
5 V
|
| Technology |
|
AVALANCHE
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
SINGLE
|
|
|
|
Compare UPTB550 with alternatives
Compare MXLUPTB5E3 with alternatives