UPD23C16340GZ-XXX-MJH-A
vs
UPD23C16040BLGY-XXX-MJH
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
TSOP1
|
|
| Package Description |
TSOP1,
|
|
| Pin Count |
48
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
65 ns
|
120 ns
|
| Alternate Memory Width |
8
|
8
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| JESD-609 Code |
e6
|
|
| Length |
18.4 mm
|
|
| Memory Density |
65536 bit
|
67108864 bit
|
| Memory IC Type |
MASK ROM
|
MASK ROM
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-10 °C
|
-10 °C
|
| Organization |
8KX8
|
4MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP1
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Current-Max |
0.007 mA
|
0.1 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN BISMUTH
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
12 mm
|
|
| Base Number Matches |
1
|
2
|
| Package Equivalence Code |
|
TSSOP48,.71,20
|
| Standby Current-Max |
|
0.00003 A
|
|
|
|
Compare UPD23C16340GZ-XXX-MJH-A with alternatives