UPD23C16000BLGY-XXX-MJH-A vs UPD23C16040BLGY-XXX-MJH feature comparison

UPD23C16000BLGY-XXX-MJH-A Renesas Electronics Corporation

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UPD23C16040BLGY-XXX-MJH NEC Electronics Group

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NEC ELECTRONICS CORP
Part Package Code TSOP1 TSOP1
Package Description TSOP1, TSOP1,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 140 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6 e0
Length 16.4 mm 16.4 mm
Memory Density 67108864 bit 262144 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -10 °C -10 °C
Organization 4MX16 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Current-Max 0.03 mA 0.014 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology MOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN/TIN BISMUTH TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm 12 mm
Base Number Matches 2 2
Pbfree Code No

Compare UPD23C16000BLGY-XXX-MJH-A with alternatives

Compare UPD23C16040BLGY-XXX-MJH with alternatives