UPC8002GR-E2
vs
UAA2077AM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEC ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
SSOP
SOIC
Package Description
LSSOP,
LSSOP, SSOP20,.25
Pin Count
20
20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.45 mm
1.5 mm
Supply Current-Max
2.2 mA
33.5 mA
Supply Voltage-Nom
3 V
4 V
Surface Mount
YES
YES
Technology
BIPOLAR
BICMOS
Telecom IC Type
CORDLESS TELEPHONE SUPPORT CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
1
2
Length
6.5 mm
Package Equivalence Code
SSOP20,.25
Compare UPC8002GR-E2 with alternatives
Compare UAA2077AM with alternatives