UAA2077AM
vs
BU8242F-DXT2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROHM CO LTD
Part Package Code
SOIC
SOIC
Package Description
LSSOP, SSOP20,.25
SOP,
Pin Count
20
20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Length
6.5 mm
12.5 mm
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
Operating Temperature-Min
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SOP
Package Equivalence Code
SSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
2.01 mm
Supply Current-Max
33.5 mA
Supply Voltage-Nom
4 V
Surface Mount
YES
YES
Technology
BICMOS
Telecom IC Type
CORDLESS TELEPHONE SUPPORT CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.4 mm
Base Number Matches
2
1
Compare UAA2077AM with alternatives
Compare BU8242F-DXT2 with alternatives