UDN2559EBTR-T vs UDQ2559B-T feature comparison

UDN2559EBTR-T Allegro MicroSystems LLC

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UDQ2559B-T Allegro MicroSystems LLC

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLEGRO MICROSYSTEMS LLC ALLEGRO MICROSYSTEMS LLC
Part Package Code LCC DIP
Package Description LEAD FREE, PLASTIC, MS-018AB, LCC-28 DIP, DIP16,.3
Pin Count 28 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL
Driver Number of Bits 4 4
Interface IC Type AND GATE BASED PERIPHERAL DRIVER AND GATE BASED PERIPHERAL DRIVER
JESD-30 Code S-PQCC-J28 R-PDIP-T16
JESD-609 Code e3 e3
Length 11.51 mm 19.05 mm
Moisture Sensitivity Level 3
Number of Functions 1 4
Number of Terminals 28 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Output Current Flow Direction SINK SINK
Output Current-Max 0.6 A 0.7 A
Output Peak Current Limit-Nom 1 A 1 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC28,.5SQ DIP16,.3
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 5.33 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Turn-on Time 20 µs 20 µs
Width 11.51 mm 7.62 mm
Base Number Matches 1 1

Compare UDN2559EBTR-T with alternatives

Compare UDQ2559B-T with alternatives