UCC5611N vs UC5613DP feature comparison

UCC5611N Texas Instruments

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UC5613DP Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description DIP, DIP24,.6 POWER, PLASTIC, SOIC-16
Pin Count 24 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Differential Output NO NO
Interface IC Type SCSI BUS TERMINATOR SCSI BUS TERMINATOR
JESD-30 Code R-PDIP-T24 R-PDSO-G16
Length 31.75 mm 9.89 mm
Number of Functions 1 1
Number of Signal Lines 18 9
Number of Terminals 24 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Pull-up Resistance-Nom 110 Ω 110 Ω
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max 7 V 5.25 V
Supply Voltage-Min 2.75 V 3.8 V
Supply Voltage-Nom 3.3 V 4.75 V
Surface Mount NO YES
Technology BICMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 15.24 mm 3.9 mm
Base Number Matches 1 3
Pbfree Code No
JESD-609 Code e0
Moisture Sensitivity Level NOT SPECIFIED
Terminal Finish TIN LEAD

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