U7004B-MFSG3
vs
SA58641DK
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SSOP
Package Description
SSO-20
LSSOP,
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
e4
Length
6.625 mm
6.5 mm
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
3.6 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
Telecom IC Type
CORDLESS TELEPHONE SUPPORT CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
2
2
Pbfree Code
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.5 mm
Supply Current-Max
8.5 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare U7004B-MFSG3 with alternatives
Compare SA58641DK with alternatives