U3600BM-NFN
vs
LMX4168FLQ/NOPB
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
|
Package Description |
SSO-44
|
HVQCCN,
|
Pin Count |
44
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G44
|
S-XQCC-N44
|
JESD-609 Code |
e0
|
e3
|
Length |
17.925 mm
|
7 mm
|
Moisture Sensitivity Level |
1
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
75 °C
|
60 °C
|
Operating Temperature-Min |
-25 °C
|
-10 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SSOP
|
HVQCCN
|
Package Equivalence Code |
SOP44,.4,32
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
29 mA
|
|
Supply Voltage-Nom |
3.6 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
CMOS
|
Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.4 mm
|
7 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
0.8 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare U3600BM-NFN with alternatives
Compare LMX4168FLQ/NOPB with alternatives