LMX4168FLQ/NOPB
vs
AN6591FJM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
PANASONIC CORP
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
VQCCN, LCC44,.24SQ,16
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N44
|
S-PQCC-N44
|
| JESD-609 Code |
e3
|
|
| Length |
7 mm
|
6 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
60 °C
|
70 °C
|
| Operating Temperature-Min |
-10 °C
|
-20 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Nom |
2.5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7 mm
|
6 mm
|
| Base Number Matches |
2
|
1
|
| Package Equivalence Code |
|
LCC44,.24SQ,16
|
| Supply Current-Max |
|
37 mA
|
|
|
|
Compare LMX4168FLQ/NOPB with alternatives
Compare AN6591FJM with alternatives