Findchips: Compare TSXPC860SRVZP40D vs TSPC860MHVZPU40B

TSXPC860SRVZP40D vs TSPC860MHVZPU40B feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	ATMEL CORP	THOMSON-CSF SEMICONDUCTORS
Part Package Code	BGA	BGA
Package Description	PLASTIC, BGA-357	,
Pin Count	357	357
Reach Compliance Code	compliant	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	40 MHz	40 MHz
External Data Bus Width	32	32
Format	FIXED POINT	FIXED POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B357	S-PBGA-B357
JESD-609 Code	e0
Length	25 mm
Low Power Mode	YES	NO
Number of Terminals	357	357
Operating Temperature-Max	110 °C	110 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA357,19X19,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.05 mm
Speed	40 MHz	40 MHz
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Width	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	3
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors