Findchips: Compare TSPC860MHVZPU40B vs TSXPC860MHVZPU40B

TSPC860MHVZPU40B vs TSXPC860MHVZPU40B feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	THOMSON-CSF SEMICONDUCTORS	MICROCHIP TECHNOLOGY INC
Part Package Code	BGA
Package Description	,	PLASTIC, BGA-357
Pin Count	357
Reach Compliance Code	unknown	compliant
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	40 MHz	40 MHz
External Data Bus Width	32	32
Format	FIXED POINT	FIXED POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B357	S-PBGA-B357
Low Power Mode	NO	YES
Number of Terminals	357	357
Operating Temperature-Max	110 °C	110 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Speed	40 MHz	40 MHz
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Position	BOTTOM	BOTTOM
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	3	3
Rohs Code		No
JESD-609 Code		e0
Length		25 mm
Package Equivalence Code		BGA357,19X19,50
Seated Height-Max		2.05 mm
Terminal Finish		TIN LEAD
Terminal Pitch		1.27 mm
Width		25 mm
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors