TSPC860MHVZPU40B vs TSXPC860MHVZPU40B feature comparison

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TSXPC860MHVZPU40B Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Part Package Code BGA
Package Description , PLASTIC, BGA-357
Pin Count 357
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Low Power Mode NO YES
Number of Terminals 357 357
Operating Temperature-Max 110 °C 110 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 40 MHz 40 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 3
Rohs Code No
JESD-609 Code e0
Length 25 mm
Package Equivalence Code BGA357,19X19,50
Seated Height-Max 2.05 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 25 mm

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