TSPC603RVDS6LX
vs
TSPC603PVA8ME
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
THOMSON-CSF SEMICONDUCTORS
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HFQFP,
|
,
|
| Pin Count |
240
|
240
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
75 MHz
|
66.67 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PQFP-G240
|
S-GQFP-F240
|
| Length |
32 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
240
|
240
|
| Operating Temperature-Max |
80 °C
|
110 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
HFQFP
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
|
| Speed |
166 MHz
|
200 MHz
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
32 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare TSPC603RVDS6LX with alternatives
Compare TSPC603PVA8ME with alternatives