TSPC603RVDS6LX
vs
MPC60350
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
HFQFP,
|
FQFP,
|
| Pin Count |
240
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
75 MHz
|
50 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PQFP-G240
|
S-GQFP-G240
|
| Length |
32 mm
|
31.305 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
240
|
240
|
| Operating Temperature-Max |
80 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
HFQFP
|
FQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
4.3 mm
|
| Speed |
166 MHz
|
50 MHz
|
| Supply Voltage-Max |
2.625 V
|
3.6 V
|
| Supply Voltage-Min |
2.375 V
|
3 V
|
| Supply Voltage-Nom |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
32 mm
|
31.305 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Additional Feature |
|
5 EXECUTION UNITS; 4 PIPELINE STAGES; BURST BUS; PHASE-LOCKED LOOP MULTIPLIER
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
2
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| RAM (words) |
|
0
|
|
|
|
Compare TSPC603RVDS6LX with alternatives
Compare MPC60350 with alternatives