Findchips: Compare TS68C000MC12.5A vs 5962-8946203MYA

TS68C000MC12.5A vs 5962-8946203MYA feature comparison

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Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	E2V TECHNOLOGIES PLC	MOTOROLA INC
Part Package Code	DIP
Package Description	DIP,	DIP, DIP64,.9
Pin Count	64
Reach Compliance Code	unknown	unknown
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	24	23
Bit Size	32	16
Boundary Scan	NO	NO
Clock Frequency-Max	12.5 MHz	12.5 MHz
External Data Bus Width	16	16
Format	FIXED POINT	FIXED POINT
Integrated Cache	NO	NO
JESD-30 Code	R-CDIP-T64	R-CDIP-T64
Length	81.28 mm
Low Power Mode	NO	NO
Number of Terminals	64	64
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	4.83 mm
Speed	12.5 MHz	12.5 MHz
Supply Voltage-Max	5.5 V	5.5 V
Supply Voltage-Min	4.5 V	4.5 V
Supply Voltage-Nom	5 V	5 V
Surface Mount	NO	NO
Technology	HCMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	22.86 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR	MICROPROCESSOR
Base Number Matches	1	6
Rohs Code		No
JESD-609 Code		e0
Package Equivalence Code		DIP64,.9
Screening Level		MIL-STD-883
Supply Current-Max		45 mA
Terminal Finish		TIN LEAD
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors