TS68882VR16
vs
TS68882VR20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
TELEDYNE E2V (UK) LTD
Part Package Code
PGA
PGA
Package Description
CERAMIC, PGA-68
CERAMIC, PGA-68
Pin Count
68
68
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-CPGA-P68
S-CPGA-P68
Number of Terminals
68
68
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Position
PERPENDICULAR
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
5
5
Rohs Code
Address Bus Width
5
Boundary Scan
NO
Clock Frequency-Max
20 MHz
External Data Bus Width
32
Length
26.92 mm
Package Code
PGA
Package Equivalence Code
PGA68,10X10
Seated Height-Max
4.184 mm
Supply Current-Max
136 mA
Terminal Pitch
2.54 mm
Width
26.92 mm
Compare TS68882VR16 with alternatives
Compare TS68882VR20 with alternatives