TS68882MF8B/Y25
vs
80387DXRPQI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
MAXWELL TECHNOLOGIES INC
Part Package Code
QFP
QFP
Package Description
,
QFF, QFL68,.95SQ
Pin Count
68
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-CQFP-G68
S-PQFP-F68
Number of Terminals
68
68
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Screening Level
CECC90000B
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
GULL WING
FLAT
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
Boundary Scan
NO
Bus Compatibility
80386
External Data Bus Width
32
Length
24.13 mm
Package Code
QFF
Package Equivalence Code
QFL68,.95SQ
Seated Height-Max
3.683 mm
Supply Current-Max
390 mA
Terminal Pitch
1.27 mm
Width
24.13 mm
Compare TS68882MF8B/Y25 with alternatives
Compare 80387DXRPQI with alternatives