TPA6130A2YZHT
vs
BH3868BFS
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROHM CO LTD
|
| Part Package Code |
BGA
|
SSOP
|
| Package Description |
DSBGA-16
|
SSOP, SOP32,.3,32
|
| Pin Count |
16
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
TONE CONTROL CIRCUIT
|
| Harmonic Distortion |
1%
|
0.01%
|
| JESD-30 Code |
S-XBGA-B16
|
R-PDSO-G32
|
| JESD-609 Code |
e1
|
e3/e2
|
| Length |
2.29 mm
|
13.6 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
0.138 W
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
SSOP
|
| Package Equivalence Code |
BGA16,4X4,20
|
SOP32,.3,32
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.625 mm
|
1.9 mm
|
| Supply Current-Max |
6 mA
|
45 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
9.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN/TIN COPPER
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Width |
2.29 mm
|
5.4 mm
|
| Base Number Matches |
1
|
3
|
| Channel Separation |
|
80 dB
|
| Number of Bands |
|
2
|
| Technology |
|
BICMOS
|
|
|
|
Compare TPA6130A2YZHT with alternatives
Compare BH3868BFS with alternatives