BH3868BFS
vs
TPA6130A2YZHR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SSOP
|
BGA
|
| Package Description |
SSOP, SOP32,.3,32
|
DSBGA-16
|
| Pin Count |
32
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.33.00.01
|
| Channel Separation |
80 dB
|
|
| Consumer IC Type |
TONE CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| Harmonic Distortion |
0.01%
|
1%
|
| JESD-30 Code |
R-PDSO-G32
|
S-XBGA-B16
|
| JESD-609 Code |
e3/e2
|
e1
|
| Length |
13.6 mm
|
2.29 mm
|
| Number of Bands |
2
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SSOP
|
VFBGA
|
| Package Equivalence Code |
SOP32,.3,32
|
BGA16,4X4,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
0.625 mm
|
| Supply Current-Max |
45 mA
|
6 mA
|
| Supply Voltage-Max (Vsup) |
9.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
7 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN/TIN COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
30
|
| Width |
5.4 mm
|
2.29 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Moisture Sensitivity Level |
|
1
|
| Output Power-Nom |
|
0.138 W
|
|
|
|
Compare BH3868BFS with alternatives
Compare TPA6130A2YZHR with alternatives