TP13054BDWR
vs
ETC5057FN-X
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
STMICROELECTRONICS
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
FULL DUPLEX
|
|
| Companding Law |
MU-LAW
|
A-LAW
|
| Filter |
YES
|
YES
|
| Gain Tolerance-Max |
0.15 dB
|
0.15 dB
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
| JESD-609 Code |
e4
|
e0
|
| Length |
10.3 mm
|
8.9662 mm
|
| Linear Coding |
NOT AVAILABLE
|
NOT AVAILABLE
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Mode |
SYNCHRONOUS/ASYNCHRONOUS
|
SYNCHRONOUS/ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SOP16,.4
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
4.57 mm
|
| Supply Current-Max |
10 mA
|
11 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
8.9662 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QLCC
|
| Package Description |
|
PLASTIC, LCC-20
|
| Pin Count |
|
20
|
|
|
|
Compare TP13054BDWR with alternatives
Compare ETC5057FN-X with alternatives