TNL17SZ74USG
vs
74LVC1G74DC-Q100H
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
SSOP
|
Package Description |
VSSOP, TSSOP8,.12,20
|
2.30 MM , PLASTIC, MO-187, SOT765-1, VSSOP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Family |
17SZ
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
|
Length |
2.3 mm
|
2.3 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
175000000 Hz
|
175000000 Hz
|
Max I(ol) |
0.024 A
|
0.024 A
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
VSSOP
|
Package Equivalence Code |
TSSOP8,.12,20
|
TSSOP8,.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
7.5 ns
|
5.9 ns
|
Propagation Delay (tpd) |
13 ns
|
13.4 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
2 mm
|
2 mm
|
fmax-Min |
250 MHz
|
200 MHz
|
Base Number Matches |
2
|
2
|
Manufacturer Package Code |
|
SOT765-1
|
Packing Method |
|
TR
|
Screening Level |
|
AEC-Q100
|
|
|
|
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