TNL17SZ74USG
vs
74LVC1G74DC,125
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ON SEMICONDUCTOR
NXP SEMICONDUCTORS
Part Package Code
SOIC
SSOP
Package Description
VSSOP, TSSOP8,.12,20
2.30 MM WIDTH, PLASTIC, MO-187, SOT765-1, VSSOP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
17SZ
LVC/LCX/Z
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e4
Length
2.3 mm
2.3 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
175000000 Hz
Max I(ol)
0.024 A
Number of Bits
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Equivalence Code
TSSOP8,.12,20
TSSOP8,.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
7.5 ns
Propagation Delay (tpd)
13 ns
13.4 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
2 mm
2 mm
fmax-Min
250 MHz
200 MHz
Base Number Matches
2
2
Manufacturer Package Code
SOT765-1
ECCN Code
EAR99
Moisture Sensitivity Level
1
Packing Method
TR
Time@Peak Reflow Temperature-Max (s)
30
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