TMX320C6454ZTZ
vs
TMS320C6454BZTZ2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
BGA,
Pin Count
697
697
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Barrel Shifter
NO
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FIXED POINT
FIXED POINT
Internal Bus Architecture
MULTIPLE
JESD-30 Code
S-PBGA-B697
S-PBGA-B697
Low Power Mode
NO
Number of Terminals
697
697
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.89 V
Supply Voltage-Min
1.71 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Rohs Code
Bit Size
32
JESD-609 Code
e1
Moisture Sensitivity Level
4
Package Equivalence Code
BGA697,29X29,32
Peak Reflow Temperature (Cel)
260
RAM (words)
32768
Terminal Finish
TIN SILVER COPPER
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
30
Compare TMX320C6454ZTZ with alternatives
Compare TMS320C6454BZTZ2 with alternatives