TMS320C6454BZTZ2
vs
TMS320C6454BZTZA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Pin Count
697
697
Reach Compliance Code
unknown
unknown
Bit Size
32
32
Format
FIXED POINT
FIXED POINT
JESD-30 Code
S-PBGA-B697
S-PBGA-B697
JESD-609 Code
e1
e1
Moisture Sensitivity Level
4
4
Number of Terminals
697
697
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA697,29X29,32
BGA697,29X29,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
32768
32768
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
1
Pbfree Code
Package Description
24 X 24 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-697
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
20
Barrel Shifter
YES
Boundary Scan
YES
Clock Frequency-Max
66.6 MHz
External Data Bus Width
64
Internal Bus Architecture
MULTIPLE
Length
24 mm
Low Power Mode
NO
Operating Temperature-Max
90 °C
Operating Temperature-Min
Seated Height-Max
3.3 mm
Supply Voltage-Max
1.89 V
Supply Voltage-Min
1.71 V
Supply Voltage-Nom
1.8 V
Temperature Grade
OTHER
Width
24 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
Compare TMS320C6454BZTZ2 with alternatives
Compare TMS320C6454BZTZA with alternatives