TMS5702125DZWTQQ1
vs
TMS5702134CZWTQQ1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
,
|
LFBGA, BGA337,19X19,32
|
Reach Compliance Code |
compliant
|
compliant
|
JESD-609 Code |
e1
|
e1
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
337
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Has ADC |
|
YES
|
Address Bus Width |
|
22
|
Bit Size |
|
32
|
CPU Family |
|
CORTEX-R4F
|
Clock Frequency-Max |
|
80 MHz
|
DAC Channels |
|
NO
|
DMA Channels |
|
YES
|
External Data Bus Width |
|
16
|
JESD-30 Code |
|
S-PBGA-B337
|
Length |
|
16 mm
|
Number of I/O Lines |
|
144
|
Number of Terminals |
|
337
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
|
NO
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LFBGA
|
Package Equivalence Code |
|
BGA337,19X19,32
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
|
Not Qualified
|
RAM (bytes) |
|
262144
|
ROM (words) |
|
2097152
|
ROM Programmability |
|
FLASH
|
Seated Height-Max |
|
1.4 mm
|
Speed |
|
180 MHz
|
Supply Current-Max |
|
375 mA
|
Supply Voltage-Max |
|
1.32 V
|
Supply Voltage-Min |
|
1.14 V
|
Supply Voltage-Nom |
|
1.2 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
16 mm
|
|
|
|
Compare TMS5702125DZWTQQ1 with alternatives
Compare TMS5702134CZWTQQ1 with alternatives