TMS5702125DZWTQQ1 vs TMS5702134BZWTQQ1 feature comparison

TMS5702125DZWTQQ1 Texas Instruments

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TMS5702134BZWTQQ1 Texas Instruments

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Package Description , LFBGA, BGA337,19X19,32
Reach Compliance Code compliant unknown
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100 AEC-Q100
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 337
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 32
CPU Family CORTEX-R4F
Clock Frequency-Max 80 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width
JESD-30 Code S-PBGA-B337
Length 16 mm
Number of I/O Lines 16
Number of Terminals 337
On Chip Program ROM Width 8
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA337,19X19,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified
RAM (bytes) 262144
ROM (words) 2097152
ROM Programmability FLASH
Seated Height-Max 1.4 mm
Speed 180 MHz
Supply Current-Max 375 mA
Supply Voltage-Max 1.32 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 16 mm

Compare TMS5702125DZWTQQ1 with alternatives

Compare TMS5702134BZWTQQ1 with alternatives