TMP68881YC-12
vs
TS68882MF20
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TOSHIBA CORP
|
THOMSON ELECTRON TUBES & DEVICES CORP
|
Part Package Code |
PGA
|
|
Package Description |
PGA,
|
QFP, QFP68,1.1SQ,50
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
12.5 MHz
|
|
External Data Bus Width |
32
|
|
JESD-30 Code |
S-CPGA-P68
|
S-XQFP-G68
|
Length |
26.92 mm
|
|
Number of Terminals |
68
|
68
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
Package Code |
PGA
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.59 mm
|
|
Supply Voltage-Max |
5.25 V
|
|
Supply Voltage-Min |
4.75 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
PIN/PEG
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
PERPENDICULAR
|
QUAD
|
Width |
26.92 mm
|
|
uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
|
Base Number Matches |
1
|
6
|
Rohs Code |
|
No
|
ECCN Code |
|
3A001.A.2.C
|
JESD-609 Code |
|
e0
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Equivalence Code |
|
QFP68,1.1SQ,50
|
Temperature Grade |
|
MILITARY
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TMP68881YC-12 with alternatives