TMP68881YC-12 vs TS68882MF25 feature comparison

TMP68881YC-12 Toshiba America Electronic Components

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TS68882MF25 Teledyne e2v

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TELEDYNE E2V (UK) LTD
Part Package Code PGA QFP
Package Description PGA, QFP, QFP68,1.1SQ,50
Pin Count 68 68
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 5
Boundary Scan NO NO
Clock Frequency-Max 12.5 MHz 25 MHz
External Data Bus Width 32 32
JESD-30 Code S-CPGA-P68 S-CQFP-G68
Length 26.92 mm 24.13 mm
Number of Terminals 68 68
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA QFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.59 mm 3.43 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 26.92 mm 24.13 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 1 6
Rohs Code No
ECCN Code 3A001.A.2.C
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Equivalence Code QFP68,1.1SQ,50
Screening Level MIL-STD-883 Class B
Supply Current-Max 136 mA
Temperature Grade MILITARY

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