TLV9004IDR vs MCP6004T-I/P feature comparison

TLV9004IDR Texas Instruments

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MCP6004T-I/P Microchip Technology Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer TEXAS INSTRUMENTS INC MICROCHIP TECHNOLOGY INC
Package Description SOIC-14 DIP, DIP14,.3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Texas Instruments
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 63 dB 60 dB
Common-mode Reject Ratio-Nom 77 dB 76 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 1600 µV 4500 µV
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4
Length 8.65 mm 19.05 mm
Low-Bias YES YES
Low-Offset NO NO
Micropower YES YES
Moisture Sensitivity Level 2
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Power NO NO
Programmable Power NO NO
Seated Height-Max 1.75 mm 5.33 mm
Slew Rate-Nom 2 V/us 0.6 V/us
Supply Current-Max 0.3 mA 0.68 mA
Supply Voltage Limit-Max 6 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1000 1000
Voltage Gain-Min 158489 25118.86
Wideband NO NO
Width 3.9 mm 7.62 mm
Base Number Matches 1 1

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