TLE6250GV33NTMA1
vs
IBM21S761
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
End Of Life
|
Contact Manufacturer
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
IBM MICROELECTRONICS
|
| Part Package Code |
SOIC
|
QFP
|
| Package Description |
SOP,
|
LFQFP,
|
| Pin Count |
8
|
80
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQFP-G80
|
| Length |
5 mm
|
12 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
80
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LFQFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.7 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Telecom IC Type |
CAN TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4 mm
|
12 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TLE6250GV33NTMA1 with alternatives
Compare IBM21S761 with alternatives