TLE6250GV33NTMA1 vs DM9162EP feature comparison

TLE6250GV33NTMA1 Infineon Technologies AG

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DM9162EP Davicom Semiconductor Inc

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Rohs Code Yes
Part Life Cycle Code End Of Life Contact Manufacturer
Ihs Manufacturer INFINEON TECHNOLOGIES AG DAVICOM SEMICONDUCTOR INC
Part Package Code SOIC QFP
Package Description SOP, LFQFP,
Pin Count 8 48
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 S-PQFP-G48
Length 5 mm 7 mm
Number of Functions 1 1
Number of Terminals 8 48
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP LFQFP
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.6 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology BICMOS CMOS
Telecom IC Type CAN TRANSCEIVER ETHERNET TRANSCEIVER
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4 mm 7 mm
Base Number Matches 1 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL

Compare TLE6250GV33NTMA1 with alternatives

Compare DM9162EP with alternatives